Pillars 01–04 · Materials Platform

Materials & Precursors

Semiconductor precursors and electronic-grade chemicals, photoresist and functional monomers, OLED and organic-electronic intermediates, and specialty polymers — synthesised, purified and analytically released on one integrated platform.

Aerial view of Shilpa Group Unit-II manufacturing site at Raichur, Karnataka
90+Semiconductor and electronic material products with CAS numbers
ppb–pptTrace-metal release by ICP-MS/MS, ~30 elements
99.99%Chromatographic purity achievable by HPLC/GC
SEMI Grade 1–5EL / UP / UPS / UPSS, to ppt–ppb metals specification
Manufacturing

Scale & Process Infrastructure

Stainless-steel and glass-lined reactor trains across Unit-I and Unit-II at Raichur and the Kadechur unit, supported by a dedicated 90-member electronic-materials R&D team.

Installed reactor volume
SiteInstalled volumeNotes
Unit-I — Raichur304 KLSpecialty, semiconductor-grade & electronic-grade chemicals, OLED, imaging, polymers
Unit-II — Raichur393 KLManufacturing + co-located electronic, semiconductor, OLED, imaging & polymer R&D
Unit-III — Kadechur165 KLHigh-volume scale-up block for monomer & specialty-chemical manufacturing
Total862 KL
Aerial view of Shilpa Group Unit-I manufacturing site at Raichur, Karnataka
Unit 1
Aerial view of Shilpa Group Unit-II manufacturing site at Raichur, Karnataka
Unit 2

Other Process Capabilities

Distillation

Column, vacuum, batch, atmospheric and short-path distillation.

Filtration

Agitated, pressure and open Nutsche filters; centrifuge and peeler centrifuge.

Cryogenic

3,000 L C-22+SS316 and 2,500 L SS316 cryogenic reactors, to −80 °C.

Pressure Reaction

Hydrogenator, pressure rating 4.0–20.0 kg/cm².

From R&D to Commercial Supply

01R&D2–5 L lab reactors. Route selection, process design, analytical method qualification.
02Pilot25–100 L reactors. Process optimization, scale-up data, qualification batch.
03Manufacturing20 L–250 KL reactors. Qualification-grade batches, customer-qualification material, CoA generation.
04Continuous SupplySteady state. Supply per customer schedule with quality continuity and on-time delivery.
Product Catalogue

90+ semiconductor-grade products, with CAS numbers

The complete electronic and semiconductor chemicals offering, organised in the eleven categories used in our published product list. Every entry carries its CAS number so it can be matched directly against your bill of materials. Specification sheets and certificates of analysis are released under NDA.

A · Photoresist Monomers & Functional Monomers

Chemical / product nameCAS No.Electronic / semiconductor application
2-Vinylphenol695-84-1Electronic polymer and photoresist polymer synthesis
3-Vinylphenol (3-Ethenylphenol)620-18-8Chemically amplified photoresists (CAR)
4-Vinylphenol (p-Hydroxystyrene)2628-17-3Photoresist polymers and dielectric materials
4,4',4'',4'''-(Propane-2,2-diylbis(cyclohexane-4,1,1-triyl))tetrakis(2-methylphenol)53091-59-1Photoresist resin and advanced polymer intermediate
p-Chloromethylstyrene (p-CMS)1592-20-7Photoresist resins and functional polymers
m-Chloromethylstyrene (m-CMS)39833-65-3Electronic coatings and crosslinkers
Vinylbenzyl Chloride (CMS Mixture)30030-25-2Photoresist and specialty polymer intermediate
o-Chloromethylstyrene (o-CMS) / 2-Chloromethylstyrene22570-84-9Advanced electronic polymer synthesis
3-Isopropenylphenol51985-06-9Functional phenolic monomer used as a building block
4-Iodostyrene (p-Iodostyrene, PIS)2351-50-0Functional monomers and photoresist building blocks
2,4,6-Trimethylstyrene769-25-5Specialty electronic polymers
4-Cyanobiphenyl 4-(2-acryloyloxyethoxy)benzoate133945-18-3Functional monomers and advanced electronic materials (or liquid crystal and display materials)

B · Aromatic & Heteroaromatic Electronic Materials

Chemical / product nameCAS No.Electronic / semiconductor application
Pentacene135-48-8Organic field-effect transistors (OFETs)
Anthracene120-12-7Organic semiconductor crystals and electronic materials
Rubrene517-51-1High-mobility organic semiconductor
2,2':5',2''-Terthiophene1081-34-1OFET and organic photovoltaic (OPV) materials
Dithieno[3,2-b:2',3'-d]thiophene3593-75-7Organic transistors and OPV
3-Bromofluoranthene13438-50-1Organic semiconductor synthesis
Benzo[1,2-b:4,5-b']dithiophene-4,8-dione32281-36-0Donor polymer synthesis
4,7-Dibromo-2,1,3-benzothiadiazole15155-41-6Organic photovoltaic polymer synthesis
4,7-Di(thiophen-2-yl)benzo[c][1,2,5]thiadiazole165190-76-1Organic photovoltaic materials
1,3-Dibromo-5-octyl-4H-thieno[3,4-c]pyrrole-4,6-dione566939-58-0Conjugated polymer synthesis
Dipyrazino[2,3-f:2',3'-h]quinoxaline-2,3,6,7,10,11-hexacarbonitrile (HAT-CN)105598-27-4OLED hole-injection layer (HIL) and charge-generation layer (CGL) material; strong electron-acceptor p-dopant

C · OLED, Display, Optoelectronic & Intermediate Materials

Chemical / product nameCAS No.Electronic / semiconductor application
1-Bromo-8-chlorodibenzo[b,d]furan2173554-83-9OLED emitter and host material intermediate
1-Bromodibenzo[b,d]furan50548-45-3OLED material synthesis
1-Bromo-3-chlorodibenzo[b,d]furan2043962-13-4OLED host/emitter material intermediate
4-Bromo-2-chlorodibenzo[b,d]furan2087889-86-7OLED host/emitter material intermediate
3-Bromo-1-chlorodibenzo[b,d]furan2409784-63-8OLED host/emitter material intermediate
4,6-Dibromodibenzo[b,d]furan201138-91-2OLED host material synthesis
4,4'-Dibromo-9,9'-spirobifluorene1257321-41-7OLED material synthesis
2,2',7,7'-Tetrabromo-9,9'-spirobifluorene128055-74-3OLED host synthesis
2,9-Dimethyl-4,7-diphenyl-1,10-phenanthroline (BCP)4733-39-5Electron transport layer (ETL)
4,4'-Di(9H-carbazol-9-yl)-1,1'-biphenyl (CBP)58328-31-7OLED host material
2,6-Bis(3-(9H-carbazol-9-yl)phenyl)pyridine1013405-24-7OLED host material
Tris(8-hydroxyquinolinato)aluminium (Alq3)2085-33-8OLED emitter and electron transport material
4,4'-Bis(2,2-diphenylvinyl)biphenyl (DPVBi)142289-08-5Blue OLED emitter
Tris(4-bromophenyl)amine4316-58-9Hole transport material synthesis
9,9'-Spirobifluorene159-66-0OLED host material synthesis
9-(2-Bromophenyl)-9H-carbazole902518-11-0OLED hole transport material synthesis
2,4,6-Triphenyl-1,3,5-triazine493-77-6OLED host material
4-(3,5-Dibromophenyl)-2,6-diphenylpyrimidine607740-08-9OLED material synthesis
1,4-Dihydroxy-2-naphthoic Acid (DHNA)31519-22-9Intermediate for OLED materials, organic semiconductors and electronic pigments
1,4-Naphthionic Acid84-86-6Intermediate for electronic dyes, pigments and photoactive specialty chemicals
3-(Benzo[d]thiazol-2-yl)-7-(diethylamino)-2H-chromen-2-one38215-36-0OLED and optical sensing

D · Triazine, Boronic Acid & Coupling Intermediates

Chemical / product nameCAS No.Electronic / semiconductor application
2-(2-Bromophenyl)-4,6-diphenyl-1,3,5-triazine77989-15-2OLED host material synthesis (triazine intermediate)
2-(3-Bromophenyl)-4,6-diphenyl-1,3,5-triazine864377-31-1OLED host material synthesis (triazine intermediate)
2-(4'-Chloro-[1,1'-biphenyl]-4-yl)-4,6-diphenyl-1,3,5-triazine1443049-86-2OLED and display materials (triazine intermediate)
(6-Phenyldibenzo[b,d]furan-4-yl)boronic acid1010068-85-5Suzuki coupling for OLED synthesis (boronic acid intermediate)
2,4-Diphenyl-6-(4-(4,4,5,5-tetramethyl-1,3,2-dioxaborolan-2-yl)phenyl)-1,3,5-triazine2088209-43-0OLED material synthesis (boronic ester intermediate)
Fluoranthen-3-ylboronic acid359012-63-8Organic electronic material synthesis (boronic acid intermediate)

E · Organic Semiconductor, OPV & Advanced Electronic Materials

Chemical / product nameCAS No.Electronic / semiconductor application
2,6-Bis(trimethylstannyl)-4,8-bis(5-(2-ethylhexyl)thiophen-2-yl)benzo[1,2-b:4,5-b']dithiophene (BDTT)1352642-37-5Distannylated BDT donor monomer for Stille-coupling synthesis of OPV donor polymers (e.g. PTB7, PM6, PBDB-T)
4,7-Bis(5-bromo-4-(2-octyldodecyl)thiophen-2-yl)-5,6-difluorobenzo[c][1,2,5]thiadiazole (PCE11 Monomer)1504626-07-6Difluorobenzothiadiazole acceptor monomer for high-efficiency donor-acceptor OPV copolymers
4,9-Dibromo-2,7-bis(2-hexyldecyl)benzo[lmn][3,8]phenanthroline-1,3,6,8(2H,7H)-tetraone (NDI-2HD-2Br)1459168-68-3Naphthalene diimide (NDI) building block for n-type polymer semiconductors used in OFETs and all-polymer solar cells
(4,4,9,9-Tetrakis(4-hexylphenyl)-4,9-dihydro-s-indaceno[1,2-b:5,6-b']dithiophene-2,7-diyl)bis(trimethylstannane) (IDTB6-2Sn)1252555-61-5Indacenodithiophene (IDT) distannyl monomer for low-bandgap donor polymers and non-fullerene acceptors via Stille coupling
2,3,6,11,12-Pentakis(pentyloxy)-8-(4-(trifluoromethyl)phenyl)triphenyleno[1,2-d]oxazole (TpOx-Ph-p-CF3)2377209-48-6UV-excitable fluorescent discotic liquid crystal; donor-acceptor charge-transfer material for OLED and organic electronic applications
8-Butyl-2,3,6,11,12-pentakis(pentyloxy)triphenyleno[1,2-d]oxazole (TpOx-n-Bu)2377209-24-8UV-excitable fluorescent discotic liquid crystal material for OLED/PLED and organic photonic applications
Y6 (BTP-4F)2304444-49-1A-DAD-A type fused-ring non-fullerene acceptor (NFA) for high-efficiency organic photovoltaics
N,N'-Dimethylperylene Diimide5521-31-3N-type organic semiconductor; perylene derivative
5-Amino-3',6'-dihydroxy-3H-spiro[isobenzofuran-1,9'-xanthen]-3-one3326-34-9Electronic dyes and sensors
TCNQ (Tetracyanoquinodimethane)1518-16-7Electron acceptor and charge-transfer complexes
Quinacridone1047-16-1Organic electronics and photoconductors
8,9,10,11-Tetrachloro-12H-isoindolo[2,1-a]perimidin-12-one20749-68-2Electronic pigments and optoelectronics

F · Photoresist Materials, Additives & Process Chemicals

Chemical / product nameCAS No.Electronic / semiconductor application
Diazonaphthoquinone (DNQ)879-15-2Photoactive compound for positive photoresists
Lithium Phenyl(2,4,6-trimethylbenzoyl)phosphinate (LAP)85073-19-4Water-soluble Type I photoinitiator for UV/visible-light polymerization, photoresists and 3D lithography
Sodium 3-Nitrobenzenesulfonate127-68-4Photoresist additive / resist formulation
Phenolphthalein77-09-8Photoresist formulations
N-Methyl-2-pyrrolidone (NMP)872-50-4Photoresist stripping and process cleaning
Dimethyl Sulfoxide (DMSO)67-68-5Photoresist stripping and cleaning
Propylene Glycol Monomethyl Ether Acetate (PGMEA)108-65-6Photoresist solvent
Hexamethyldisilazane (HMDS)999-97-3Photoresist adhesion promotion on silicon wafers
[2-(3,6-Dimethyl-9H-carbazol-9-yl)ethyl]phosphonic acid (Me-2PACz)2996161-30-7Self-assembled monolayer: hole-selective SAM for inverted (p-i-n) perovskite and perovskite/silicon tandem solar cells
[4-(3,6-Dimethyl-9H-carbazol-9-yl)butyl]phosphonic acid (Me-4PACz)2747959-96-0Application not stated in source list
Sodium Tetraphenylborate (STB)143-66-8Photoresist formulation, ion-pairing/electrolyte additive and catalyst precursor

G · Fluorinated Electronic Chemicals

Chemical / product nameCAS No.Electronic / semiconductor application
Sodium Pentafluorobenzenesulfonate120193-44-4Fluorinated photoresists and specialty electronic materials
2,3,4,5,6-Pentafluorostyrene653-34-9Fluorinated styrenic monomer

H · Metal / Metalloid Precursors — ALD, CVD & Thin-Film Deposition

Chemical / product nameCAS No.Electronic / semiconductor application
Tris(dimethylamino)silane (TDMAS)15112-89-7Silicon precursor for ALD
Bis(ethylcyclopentadienyl)ruthenium(II)32992-96-4Ruthenium ALD/CVD and metal deposition
Tris(acetylacetonato)iron(III)14024-18-1Thin-film deposition and metal-organic precursor
Trimethylgallium (TMGa)1445-79-0GaAs and GaN semiconductor deposition

I · Acids, Bases & Wet-Process Chemicals

Chemical / product nameCAS No.Electronic / semiconductor application
Hydrochloric Acid (HCl)7647-01-0Wafer cleaning and etching
Nitric Acid (HNO3)7697-37-2Removal of metallic and organic contaminants
Sulfuric Acid (H2SO4)7664-93-9Wafer cleaning and etching
Hydrofluoric Acid (HF)7664-39-3Silicon wafer and silicon oxide etching
Phosphoric Acid (H3PO4)7664-38-2Cleaning and etching
Acetic Acid64-19-7Cleaning and wet-process applications
Citric Acid77-92-9Mild cleaning and etching applications
Phenol108-95-2Specialty electronic chemical and resin applications
Potassium Hydroxide (KOH)1310-58-3Wet etching, particularly MEMS fabrication
Potassium Carbonate (K2CO3)584-08-7Cleaning and process applications
Ammonium Hydroxide (NH4OH)1336-21-6RCA wafer cleaning and wet processing
Tetramethylammonium Hydroxide (TMAH)75-59-2Photoresist developer and silicon etchant
Hydrogen Peroxide (H2O2)7722-84-1Wafer cleaning and wet processing

Supplied to SEMI Grade 1–5 (EL / UP / UPS / UPSS) against a ppt–ppb metals specification.

J · Solvents & Cleaning Chemicals

Chemical / product nameCAS No.Electronic / semiconductor application
Isopropyl Alcohol (IPA)67-63-0Semiconductor wafer cleaning and drying
Methanol (MeOH)67-56-1Cleaning and process solvent

K · Electronic Polymers & Functional Polymers

Chemical / product nameCAS No.Electronic / semiconductor application
Poly(hydroxystyrene) (PHS)24979-70-2Photoresist polymer
Poly(3-hexylthiophene-2,5-diyl) (P3HT)104934-50-1Conductive polymer / OPV material
Poly(9-vinylcarbazole) (PVK)25067-59-8OLED polymer / hole transport polymer
Poly(9,9-dioctylfluorene) (PFO)123864-00-6Light-emitting polymer
Pillar 04

Specialty & Functional Polymers

Photosensitive polyimides, directed self-assembly block copolymers, photoresist base resins and optoelectronic conjugated polymers — with polymerization and functionalization developed in-house and scaled through qualification.

Key polymers in semiconductor & optoelectronic applications
Application areaPolymer classRepresentative examples
Semiconductor — front-endPhotosensitive Polyimides (PSPI)Functionalized polyimides for lithographic patterning
Semiconductor — front-endDirected Self-Assembly (DSA)PS-b-PMMA, PS-b-PDMS, PS-b-PEO block copolymers
Semiconductor — front-endPhotoresist Base ResinsPoly(hydroxystyrene) (PHS) for chemically amplified resists
Semiconductor — back-endNon-Photosensitive PolyimidesPolypyromellitimide for device encapsulation
Semiconductor — back-endEpoxy PolymersBase epoxy resins for back-end-of-line packaging
Display & optoelectronicsConductive / Photoactive PolymersP3HT, PVK, PFO & donor–acceptor copolymers

Polymerization Platforms

01

Chain-Growth

Anionic & cationic, free-radical/ATRP, ring-opening (ROP) and coordination polymerization. Catalysts: n-BuLi, borates, Ziegler–Natta.

02

Controlled / Living

ATRP, RAFT and living anionic/cationic routes for precise molecular weight and narrow PDI. Cu-ATRP and RAFT agents.

03

Step-Growth

Polycondensation and polyaddition; interfacial and melt-phase step-growth. Redox / persulphate initiation.

04

Multiphase

Emulsion, suspension and mini-emulsion polymerization for controlled particle morphology.

Functionalization Strategies

Backbone & pendant-group

Hydroxyl (–OH): telechelic and multifunctional OH-bearing polymers, adhesion promoters. Acrylate/methacrylate: UV/EB-curable systems, diluents and stabilizers. Carboxylic acid: direct –COOH installation via CO2 and ion-exchange chemistry.

End-group

Amine, epoxy and thiol click-chemistry and crosslinkable end-groups engineered for downstream device integration — installed by functional initiator at chain start or by post-polymerization transformation.

Capability

Chemistry Platforms — Molecule to Chip

Reaction chemistries developed for OLED, imaging, photoresist and semiconductor-precursor materials, executed under inert atmosphere with glove-box control at O2 and H2O below 1 ppm.

Carbazole Chemistry

Core scaffold for OLED hosts. Ring construction by Cadogan cyclization; N- and ring-functionalization via Buchwald amination, Ullmann and Suzuki coupling.

Triphenylamine (TPA)

Hole-transport materials and OLED hosts. C–N bond formation via Buchwald–Hartwig, Ullmann and Chan–Lam coupling; aryl extension by Suzuki coupling.

Spiro Compound Synthesis

Rigid, high-triplet-energy architectures for OLED, imaging and perovskite solar materials, via double Friedel–Crafts and intramolecular cyclization.

Boronic Acid Chemistry

Suzuki–Miyaura building blocks via Pd-catalyzed Miyaura borylation, lithiation–boronation and iridium-catalyzed C–H borylation.

Organometallic Chemistry

Grignard, organolithium, Negishi and Stille reagents under inert atmosphere — Schlenk lines and glove box at O2 & H2O <1 ppm.

Oxidation & Reduction

Dess–Martin, Swern and TEMPO oxidation; catalytic hydrogenation (Pd/C, Raney Ni) and selective hydride reductions (DIBAL-H, LAH, Red-Al).

Functional Group Transformations

Williamson ether synthesis, Mitsunobu and Sandmeyer reactions, Vilsmeier–Haack formylation, Kolbe–Schmitt carboxylation.

Precursor Synthesis

Organometallic and metal-organic precursors for CVD and ALD deposition; sublimation and resin-based purification to device-grade purity.

Scientific Approach

Synthesis to Semiconductor Grade

Purity governs device yield. Every process step is engineered to remove a specific impurity class — metals at ppb, anions, organics, moisture and particles — and each is verified analytically before release.

Stage 01Controlled SynthesisInert-atmosphere chemistry under N2/Ar; glovebox O2 & H2O <1 ppm. Cryogenic synthesis down to −80 °C, high-temperature processing, and high-pressure hydrogenation capabilities.
Stage 02High-Purity PurificationSublimation and resin chemistry for organometallics; fractional and short-path distillation of electronic solvents; ion exchange and nanofiltration to ppb metals.
Stage 03Semiconductor FiltrationGraded filtration 0.2 → 0.1 → 0.05 µm; PTFE assemblies for acid and corrosive streams; fine-particle control to electronic-chemical specification.
Stage 04Analytical ReleaseICP-MS/MS, LC-MS/MS and GC-MS for trace ionic and organic impurities; IR, DSC and TGA for identity and thermal stability; coulometric moisture analysis.
Quality Infrastructure

Analytical & Testing Suite

Trace-level analytical release is built into every batch, from ppb metals through to molecular-weight distribution and viscoelastic behaviour.

Analytical instrument in the Shilpa electronic materials testing laboratory
Trace metals ICP-MS/MS analysis to ppb–ppt across approximately 30 elements.
Chromatography and mass spectrometry instrument in the testing laboratory
Chromatography & mass ID LC-MS/MS and GC-MS/MS for impurity identification and residual solvents.
Sample preparation and wet analytical bench in the testing laboratory
Sample preparation Controlled preparation and wet analysis ahead of instrumental release.
Installed instrumentation
InstrumentMake / modelApplication
ICP-MS/MSAgilent 8900 / Thermo iCAP RQTrace metals, ppb–ppt (~30 elements)
ICP-OESPerkin Elmer Optima 8000Metals quantification
LC-MS/MSSciex 4500 / Thermo / Sciex 3200 QTRAPMass ID & impurity quantification
GC-MS/MSAgilent 7010B / ThermoVolatile impurities, residual solvents, monomers
GPCAgilent 1260 Infinity GPC/SEC MDSMolecular weight & purity
DSC / TGAPerkin Elmer DSC 8000 / Pyris1Thermal transitions & stability
SEMTescan VEGA3Microstructural characterization
Ion ChromatographyMetrohmChlorides, sulfates, nitrates, phosphates, ammonium at ppm
Potentiometry / UV-VisMetrohm 905 Titrando / ShimadzuAssay; non-chromophore compounds by CAD & RI detectors
Viscometer / RheometerBrookfield / Netzsch KinexusDynamic & kinematic viscosity; viscoelastic evaluation

Also performed: chromatographic purity to 99.99% by HPLC/GC, isomer analysis by HPLC/GC, unknown identification by LC-MS/GC-MS, colour by APHA method, and coulometric moisture analysis to electronic-grade specification, supported by ISO/IEC 17025-aligned testing capabilities.

Need a specification we haven't listed?

The published tables are representative. Full product lists, specification sheets and certificates of analysis are released under NDA — send us the CAS number, purity target and volume and we will come back with a feasibility position.