Defensible Technology
Confidential alloy formulations and protected process know-how, backed by long qualification cycles that are hard to displace once approved.
Pillar 05 · Platform
Precision Bonding Wires
India's first localized precision bonding-wire manufacturer, serving Integrated Device Manufacturers and Outsourced Semiconductor Assembly and Test providers with gold, silver and copper interconnect wire — cast, drawn, annealed and packed in house.
15 µmFinest bonding wire diameter — 0.6 mil
>80%Localized materials and processes
7-stageIn-house platform, from casting through to packing
Precision Bonding Wires
Developed with a global bonding-wire technology partner, Shilpa is localizing gold, silver and copper bonding-wire production for Integrated Device Manufacturers and Outsourced Semiconductor Assembly and Test providers — combining proprietary alloy formulations, protected process know-how and an end-to-end in-house platform running from casting through packaging.
| Wire material | Diameter range | Elongation | Breaking load | Primary application |
|---|---|---|---|---|
| Gold (Au) | 15–30 µm (0.6–1.2 mil) |
2–8% | 2.0–11.0 cN | Advanced IC packaging; high-reliability devices needing premium conductivity and durability |
| Silver / Ag-Alloy | 15–30 µm (0.6–1.2 mil) |
2–13% | 2.0–9.0 cN | Optoelectronics and LED packaging; high-volume cost/performance manufacturing |
| Copper (Cu) | 18–38 µm (0.7–1.5 mil) |
6–30% | 3.0–18.0 cN | Discrete components (SOT, SOP, QFN); cost-efficient and robust ICs |
Gold wire is characterised by high purity and optimised heat-affected zone for arc strength and stability. Silver alloys deliver excellent bondability, low resistance, high reflectivity at short wavelengths and long shelf life. Copper offers strong mechanical properties, excellent conductivity, loop stability and slow intermetallic compound growth.
Why Shilpa Bonding Wire
01
02
Localized Supply Chain
More than 80% of materials and processes localized, reducing exposure to imported interconnect supply.
03
Scalable Infrastructure
Facility engineered for five-fold capacity expansion within five years.
04
Operational Excellence
In-house process control from casting to packaging, giving consistency and full traceability.
Development & Manufacturing Process
A seven-stage in-house platform. Nothing in the interconnect chain is outsourced, which is what makes lot-to-lot consistency and traceability defensible under IDM and OSAT qualification audits.
In-house · casting through to packaging
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Melting
High-purity metals under controlled conditions
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Alloying
Proprietary formulations
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Crystallization
Controlled solidification for microstructure
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Drawing
Fine-diameter consistency
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Annealing
Ductility & mechanical integrity
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Winding
Stable handling
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Packing
Traceable, protocol-driven
High-Purity Materials
Alongside bonding wire, Shilpa Group supplies high-purity materials for advanced electronic and semiconductor applications, including sputtering materials, supported by robust metal-purification and traceability infrastructure.
Gold
4N–5N purity grades.
Silver
4N–5N purity grades.
Nickel
High-purity sputtering target material.
Copper–Tin Alloys
Alloy targets and other specialized metals to specification.
Looking for a precision bonding wire partner?
Bonding wire qualification cycles are long, which is exactly why they are worth starting early. Send us your wire specification — diameter, elongation, breaking load and package type — and we will come back with a qualification plan and sampling timeline.